春風吹又生:矽谷華人探討半導體業回升尋找未來突破

在 歐美大陸剛剛經歷了2008-2009年的經濟危機後，在舉世矚目的高科技聖地美國矽谷，華人工程師們對高科技的核心半導體行業的未來及復興開始了新一輪 的探索。華美半導體協會（Chinese American Semiconductor Professional Association）將為此專門舉辦春季半導體行業研討會。此次大會主題是半導體行業回升及對未來集成電路制造，設計及應用新技術的探索及前景的展 望。屆時將有來自矽谷半導體行業巨頭 Intel, Cadence, EMC的執行長，副總裁，以及加州大學伯克利分校主任教授兼美國國家實驗室主任出席並進行主題演講。演講內容包括摩爾定律的未來；集成電路制造工藝面臨的 新挑戰；納米光刻技術新突破； 多核構架和系統集成芯片的開創性設計及驗正方法；以及如何打造以多核芯片構架為核心的超速數據處理系統雲計算平台。此次大會將在三月六日下午在Intel 矽谷聖塔克拉拉總部舉行。大會具體詳情，請到華美半導體協會網址查詢http://www.caspa.com/events/symposium

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With global economy still being deeply in recession, the high tech industry in Silicon Valley has already been positioned for a strong recovery.  At the heart of today’s information technology, semiconductor technology is undergoing a new round of innovation driven by future demands from hardware to software applications. The Moore’s Law continues to advance, but with increasing challenges, where process and design are required to be co-optimized to achieve the best scaling benefit. Recent technology breakthrough in nano-scale lithography has unveiled future direction for semiconductor fabrication.  Targeting to achieve higher performance with more efficient computing, the computing paradigm is experiencing a big reform from traditional frequency driven pipelining techniques to either multi-core homogenous computing with massive parallelism, or highly integrated system-on-chip solutions with heterogeneous computing. Multi-core architectures are both platforms and targets for future IC design, as well as the kernels for future throughput computing for data center applications.

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