朱兆凡 - 2001年 傑出校友獎 得獎人Name: Richard C. Chu 朱兆凡
Year Graduated: 1956, Mechanical Engineering
Address: IBM Corporation, P520, 2455 South Road, Poughkeepsie, NY 12601-5400
Telephone: (914)433-5236 Fax:(914)432-9805
E-Mail:
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Education
BS (Mechanical Engineering) 1956 - National Cheng-Kung University
MS (Mechanical Engineering) 1960 - Purdue University
Honorary Doctor of Science 1992 - American University of the Caribbean
Honorary Doctor of Engineering 1996 - Purdue University Experience
Heat Transfer Engineer 1960-1966
Heat Transfer Technology Manager 1966-1969
Thermal Engineering Lab Manager 1969-1975
Product Technology Manager 1975-1979
Engineering Lab Manager 1979-1983
IBM Fellow 1983-Present
Member, National Academy of Engineering, USA 1987-Present
Member, Academia Sinica, ROC 1996-Present Achievements
• Made significant contributions to the development of cooling technology and thermal systems for electronic equipment in general and large-scale computers in particular. Invention achievements are documented in over 70 patents and over 150 patent disclosure publications, most of which have been reduced to engineering applications across IBM product lines. Many of his patents and publications have been recognized outside of IBM as industry standards for the cooling of electronic equipment. Published extensively, including two books, five book chapters, and over 50 technical publications. Professional Recognition
• ASME Fellow (American Society of Mechanical Engineers) 1982
• AAAS Fellow (American Association for the Advancement of Science) 1988
• Distinguished Engineering Alumnus Award, Purdue University 1984
• Distinguished Alumnus Award, National Cheng-Kung University 1986
• Elected President, IBM Academy of Technology 1991 Awards and Honors
• IBM Invention Achievement Awards (30) 1967-2001
• IBM Outstanding Innovation Awards (4) 1970-1981
• IBM Corporate Award (1) 1982
• ASME Heat Transfer Memorial Award 1986
• Purdue University Hawkins Memorial Lecturer 1992
• Catholic University C.C. Chang Memorial Lecturer 1995
• I-THERM Memorial Award 1995
• Dynamic Achiever Award from OCA (Organization of Chinese Americans) 1998
• OCA National Asian American Corporate Achievement Award 1999 Contribution to Universities, Alumni Association, and/or Community
• Member of various advisory committees at Comell university, Lafayette College, Purdue
University, Georgia Tech, Florida State University and National Academy of Engineering
• First elected President of Mid-Hudson Chinese Community Association
A Few Things From My Memory and My Heart
I am truly honored to be here and I want to thank everyone who made this possible, especially the CK.UAA of New York who nominated me for this award. Each occasion like this is another reminder to me of how lucky I have been all these years. I had a very special relationship with Cheng-Kung
University because my late father, Liang-His Chu was a professor of mechanical engineering at the university for 22 years, from 1949 to 1971. After completing ROTC, I received my degree and joined IBM in 1960. Since 1952, for almost half a century 1,1 have been associated with only 4 places, CK, ROTC, Purdue and IBM. I have always been surrounded by good people who taught me, inspired me,
challenged me, and most importantly supported me.
Many young people, including my own children have asked me what is my secret to enjoy smooth sailing for so long. I honestly do not know the answer, but, I firmly believe that the key to success in professional life is an investment of hard work and perseverance. "Luck favors a prepared mind" -Dr. Pasteur. Indeed, it has been my experience that the harder you work the luckier you get. I also believe that we must live a balanced life, this means doing many things, such as going to church, regular exercise, and engaging sports you like. Personally I enjoy winter skiing, summer sailing, daily walking and golfing whenever possible. Finally, I have been happily married since 1963 and I will let the picture shown below to tell the rest of my story.
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